Key Parameters of Industrial Computer PCB

Commodity Name: Industrial Computer Printed Circuit Board

Brand Name: HFast

Layers: 6L

Board Thickness: 1.60mm

Minimum Hole Size: 0.20mm

Minimum Line Width: 0.10mm

Minimum Line Spacing: 0.10mm

Color: Green Oil and White Legend

Surface Treatment: Gold Plating

Characteristics of different types of Industrial Computer PWB

1. Desktop motherboard:

*Size standardization: ATX, Micro ATX, Mini ITX, etc.

*Strong scalability: Provides multiple PCIe and memory slots.

*High power demand: Supports high-performance CPUs and independent graphics cards.

*The heat dissipation space is relatively abundant.

1. Laptop motherboard:

Extremely compact:Space is the primary constraint, and the number of layers may be higher to save area.

*Highly integrated: CPU, GPU (possibly integrated), chipset, memory (possibly onboard), and some interface controllers are highly integrated.

Rigid flexible combination board:may be used to connect screens, cameras, and other parts that require movement or limited space.

Heat dissipation design is extremely important:Small space, high heat density.

*Strict power consumption control: The requirements for VRM efficiency and heat dissipation are extremely high.

3. Server/Workstation Motherboard:

Extra Large Size:Supports multiple CPU sockets, massive memory (more DIMM slots), and extensive PCIe expansion.

Ultimate stability and reliability:Made of top-notch materials, designed with redundancy (such as dual network cards and management ports), supporting ECC memory.

Extremely powerful power supply: Provides power to multiple high-power CPUs.

High speed interconnection:Supports more high-speed network interfaces (10 Gigabit/higher speed) and NVMe storage.

Powerful management function: Integrated BMC (baseboard management controller).

Design and Manufacturing Challenges of Industrial Computer PCB

1.Design complexity: Requires proficiency in high-speed digital design, power design, EMC design, thermal design, DFM (design for manufacturability).

2. Simulation driver: heavily relies on SI (signal integrity), PI (power integrity), and EMI simulation tools for preliminary verification.

3. Material cost:High performance substrates, thick copper, and high-rise digital displays increase costs.

4. Manufacturing accuracy: The requirements for interlayer alignment, line width and spacing control, drilling accuracy (especially laser drilling micro holes), and electroplating uniformity are extremely high.

5. Quality control: 100% electrical testing (flying needle/needle bed), AOI (automatic optical inspection), and X-Ray testing (BGA soldering) are essential.