*Meet increasingly stringent environmental and reliability requirements, especially in high-pressure and high-temperature environments for electric vehicles.

*Dealing with signal integrity and power integrity challenges brought by high-speed and high-density design.

*Control costs, especially in the case of large-scale adoption of new technologies such as HDI and high-frequency materials.

*Supply chain security and stability.

*Meet the requirements of functional safety standards such as ISO 26262.

2.Development Trends:

Higher density interconnection: More layers, thinner line width/spacing, smaller via holes (mSAP process).

*High frequency and high-speed: To meet the demands of 5G V2X, millimeter wave radar, and high-speed Ethernet, higher requirements are placed on materials and design.

*Integration and modularization: Domain controllers and central computing platforms integrate multiple functions, requiring PCBs to carry more functions and higher power density.

*Upgraded heat dissipation technology: With the application of power devices (SiC, GaN) and the improvement of computing power, efficient heat dissipation solutions (such as IMS, heat pipe integration) are becoming increasingly important.

*New material applications: Higher performance substrates (lower losses, higher thermal conductivity), new surface treatments.

*The application of rigid flexible combination board has increased: it adapts to more compact and flexible installation requirements.

*Intelligent design and simulation tools: Utilizing AI/ML to optimize design, improve simulation accuracy and efficiency.

*Sustainability: Exploring more environmentally friendly materials and manufacturing processes.

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